Electronic Module Assembly

Job Description

Job Location
Electronic Module Assemby Technician I
Job Type
Job Order

TCI has an immediate need for an Electronic Module Assembly Technician Level I in Clifton, NJ.  This is not a Corp2Corp opportunity.  This is a long term contract opportunity with probable extension and possible hire.  This position requires a current DoD Secret Clearance.


TCI is offering an excellent DoD Contract opportunity with our government/military sector client in Clifton, NJ.  If you enjoy a collaborative and creative work environment, this is a great opportunity for you to join a rapidly growing IT team.  Promoting from within is a routine best practice in an environment where individuals are encouraged to advance their careers.

The Electronic Module Assembly (EMA) Technician will perform various process steps associated with Circuit Card Assemblies and/or Electronic Modules Assemblies.


  • Perform adhesive application, lead forming, component installation, laminating, soldering, wiring, trimming, minor modifications, mechanical assembly, physical testing (i.e. leak testing, buzz out, etc.), etc., on mechanical and electrical assemblies and subassemblies.
  • Complete all required documentation of work performed, such as travelers and first piece inspection sheets.
  • Set-up and provide basic maintenance to machines and equipment, and conduct inspections of own work and work of others.
  • Responsible for helping meet quality, cost and schedule requirements
  • Lead form simpler CCA components as necessary in preparation for assembly to CCA’s, with assistance as needed. 
  • Apply marking labels to CCA’s and SEM's in accordance with configuration documentation and assembly drawing requirements, with assistance as needed.
  • Maintain floor stock inventory of tape and reeled components stored in “post-deduct” (PD) locations on the assembly floor.
  • Load tape and reeled component feeders to prepare a “set-up” for later introduction into the pick and place machine, with assistance as needed.
  • Maintain stencils and operate stencil cleaning equipment, with assistance as needed.
  • Operate and maintain Heller (or similar) conveyorized reflow oven in accordance with operating procedures on various types of circuit card assemblies, with assistance as needed.
  • Perform lamination of boards to heat sinks in accordance with relevant documentation, with assistance as needed.
  • Perform manual application of various adhesives, thread locking compounds, thermal compounds, etc. using appropriate dispensing equipment in accordance with associated documentation and standard work practices.
  • Manual installation and soldering of components using thru-hole and surface mount technology.
  • Perform isolation of particular pins, either by lifting leads or installing isolators as designated and with assistance as needed.
  • Installation of terminals, eyelets, rivets, etc., utilizing associated presses and dyes in accordance with documentation and with assistance as needed.
  • Assemble cables and flex circuits to CCA’s. May include soldering and/or application of adhesives, thread locking compounds and the use of torque controlling tools, with assistance as needed.
  • Touch-up of CCA’s that have been run through the automated assembly and reflow line or wave solder machine and may be required in preparation for, or following test.
  • Masking and unmasking of CCA’s in preparation for and following application of conformal acrylic or parylene based coatings, with assistance as needed.
  • Spray application of acrylic based conformal coating (i.e. Humiseal 1B31) in accordance with applicable quality workmanship standards and operating procedures, with assistance as needed.
  • Operate and maintain solder pots used for tinning component leads in accordance with applicable documentation, quality workmanship standards and operating procedures, with assistance as needed.
  • Operate and perform basic maintenance (cleaning) of Branson (or similar) automated, conveyorized degreasing equipment, to clean and deflux boards as required by process documentation.
  • Perform lamination of boards to heat sinks in accordance with relevant documentation, with assistance as needed.


  • Previous experience related to responsibilities is required.
  • Candidate must currently possess an active DoD Secret Security Clearance.
  • Must be able to work utilizing a microscope.
  • Candidate must possess the ability to read & build from engineering drawings, parts lists, configuration management reports, engineering change notices & methods instructions.
  • High School Diploma/GED (or higher) is required.  Some College or Technical College is a plus.

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